MediaTek Announces First Dimension Cockpit Solution in Partnership with Nvidia

 

At GTC, Nvidia’s GPU technology conference, MediaTek announced the first Dimension Auto Cockpit SoC which is the result of its previously announced partnership with Nvidia. According to MediaTek, the new Dimensity CV-1, CM-1, CY-1 and CX-1 will target entry-level in-vehicle experiences with the CV-1 to premium in-vehicle experiences with the CX-1. The new products will feature a combination of Arm V9-A CPU cores, an HDR image signal processor (ISP), a multi-audio DSP, support for multiple cameras, AI processing capabilities, and an Nvidia RTX GPU. Additionally, the platform will support Nvidia’s Drive OS software platform. According to the company, the new SoCs will deliver a secure and entertaining experience with support for multiple cameras, displays, audio formats, as well as the latest graphics capabilities and generative AI applications. Although technical details of the products are limited at this time, this is just an announcement of the products that predicts important milestones for the industry.

 

First, the announcement signals positive progress from the partnership to produce a family of products using the chiplet strategy in less than a year after the partnership was announced. While the use of chiplets is becoming the standard for high-end processors and accelerators, it is notable for more mainstream embedded/IoT-focused applications. However, Tirias Research believes that the use of chiplets in these types of applications will become more common by the end of the decade as UCIE chiplet standards are adopted, testing standards for chiplets are established among semiconductor foundries, and Mass production reduces costs. Packaging.

Chiplets will allow more rapid development of chips that are highly differentiated, such as the Dimension Auto Cockpit product family. Dimension Auto Cockpit products combine licensed intellectual property (IP) from the design expertise of Arm, IP and MediaTek and the graphics and software expertise of Nvidia without the need to house everything on a single die. Tirias Research estimates that this could reduce the time from initial concept to product testing by up to 50% from today’s timelines, and could increase even more as the use of chiplets from multiple vendors and foundries becomes more common. . In this case, all chiplets are produced by a single foundry, TSMC, eliminating the challenge of having multiple foundries.

Another significance of this announcement is that it represents Nvidia’s constantly changing business model. While Nvidia has offered GPU IP for licensing in the past, there were no buyers. This could open doors to leveraging Nvidia Semiconductor IP, especially when combined with the company’s leading software platform and AI Foundation model for other market segments and applications.

The final conclusion is what this means for not only MediaTek, but the rest of the semiconductor industry. By using licensed IP combined with chiplets, barriers to entry into new markets or segments are being lowered while the ability to differentiate between products is being increased. There is no doubt that OEMs across industry sectors will want to take advantage of the ability to customize chips for specific applications. This allows for greater product differentiation as well as the ability to pack more semiconductor material into a single package for higher display efficiency while reducing system complexity and cost.

While we await additional details about the new Dimension Auto Cockpit SoC and other Dimension Auto drive, connect and component products, this announcement marks a milestone for the MediaTek-Nvidia partnership and the industry as it reflects the changing dynamics of semiconductor design. Develops around. Production.

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